5. electronics industry protection. Conductive packaging products are mainly used in the electronic components of the IC wafer, IC packaging, testing, TFT-LCD, photovoltaic, and other packaging, the goal is to avoid contact with other charged objects, resulting in part due to charges friction sparks damage. There is also conductive, antistatic plastic plates, crates and so on. With the increase of strength properties of PP ethylene content increases. PP Vicat softening temperature of 150 ℃. Due to the high degree of crystallinity, rigidity and resistance to scratches the surface of this material is very good. PP environmental stress cracking problem does not exist. Generally, the use of glass fiber, metal additives or thermoplastic rubber modified PP. Applications: Acid equipment, Liunan PP plastic MILL, environmental protection equipment, waste water, emissions equipment, scrubbers, Sichuan PP plastic MILL, clean rooms, semiconductor plant and equipment related industries, is also the manufacture of plastic The preferred material tank, wherein PP thick sheet is widely used in the punching plate, punch plate and so on. White PP sheet with a light, uniform thickness, smooth surface, good heat resistance, corrosion resistance, high mechanical strength (impact, deformation), excellent chemical stability and electrical insulation, non-toxic characteristics. White PP sheet is widely used in chemical containers, machinery, electronics, electrical appliances, food packaging, pharmaceuticals, decorating and water treatment. Shandong PP plastic MILL _ Zhen Wei Plastic (certified) _ Xingbin PP plastic MILL provided by Foshan Plastics Co., Ltd. Wei Zhen. Foshan Plastics Co., Ltd. Wei Zhen (cxsy2009.1688.com/) Guangdong Foshan, other leaders, over the years, the company implement the scientific management, innovation and development, the principle of honesty and trustworthiness, and satisfy customer needs. In Zhen Wei Plastic leadership with the staff warmly welcome all inquiries negotiations to create Zhen Wei Plastic better future.